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Banda portadora de semicondutores

Qualidade Banda de transporte anti-deformação SOD323 com design de bolso fino de 8 mmx1500m Fábrica

Banda de transporte anti-deformação SOD323 com design de bolso fino de 8 mmx1500m

Product Description This black anti static SOD323 carrier tape is designed for SOD323 electronic component packaging, storage, long distance transportation protection, SMT automatic feeding, and component sorting. Made from PC+PS material, it provides stable pocket forming performance and anti static protection for small SMD diode type components that require reliable reel packaging before assembly. The tape is supplied in 8mm*1500m per reel, which is suitable for batch
Qualidade SOT323 Material ABS de bobina de cinta em relevo não tóxico para embalagens de componentes de IC Fábrica

SOT323 Material ABS de bobina de cinta em relevo não tóxico para embalagens de componentes de IC

SOT323 Black Anti Static Carrier Tape Product Overview The SOT323 Black Anti Static Carrier Tape is designed for SOT323 electronic component packaging, warehouse storage and SMT automatic feeding. Produced from ABS anti static material, this carrier tape helps protect sensitive SMD components from electrostatic influence during handling, packing, reel winding and logistics transfer. The black carrier tape body provides clear contrast for visual inspection, allowing operators
Qualidade 0805-3 fita transportadora de semicondutores à prova de poeira reforçada 0805 suporte de bolso Fábrica

0805-3 fita transportadora de semicondutores à prova de poeira reforçada 0805 suporte de bolso

The 0805-3 Black Anti Static Carrier Tape is designed for 0805-3 electronic component packaging, storage and SMT automatic feeding. It is manufactured from ABS anti static material, making it suitable for SMD components that require organized reel packaging and controlled handling before assembly. The black carrier tape appearance provides clear contrast for inspection, helping operators check pocket forming, tape direction and component placement during packaging and